应用焊接预制片 – 加热 (与客星Brandon Judd)

{0>For this week’s World of Solder Preforms series installment, Brandon Judd explains the importance of reflow profiling:<}0{>对于本周焊接预制片世界的系列部分，Brandon Judd 解释了下列回流曲线的重要性:<0}

{0>Solder preforms are a very common method of reducing voiding in a soldered device with larger X/Y dimensions.  Compared to solder paste (which is approximately 50% flux by volume), flux-coated solder preforms generally contain only 0.5 to 2% flux by weight.  In some cases, such as when using AuSn preforms on Au surface metallizations, you can even solder completely fluxlessly! <}0{>焊接预制片是一种极其常见的方法，利用更大的 X/Y尺寸可以降低焊接设备的空隙。与焊膏相比(按体积大约为50%的助焊剂), 涂敷助焊剂预制片的焊接预制片一般只含有0.5至 2%的助焊剂（重量）。在某些情况下，如果在利用Au的表面金属化上使用AuSn,你们甚至可以不使用助焊剂进行焊接!<0}

{0>Reducing the quantity of flux means there is less outgassing during reflow, and therefore less voiding.  Reflow process optimization can further improve the voiding performance of solder preforms.  For comparison:<}0{>减少助焊剂的数量意味着回流期间的除气更少,因此空隙更少。回流工艺的优化可以进一步改善焊接预制片的空隙性能。作为比较:<0}

• {0>below on the left is an x-ray image of a flux-coated 63Sn 37Pb preform sandwiched between Ag-plated coupons, reflowed with a longer soak style reflow profile<}0{>左边下面是一种涂敷63Sn 37Pb的预制片，夹在涂Ag试件的x-线图象，回流时带着较长的浸渍型回流曲线。<0}
• {0>while the image on the right depicts the same stack-up with a shorter ramp-to-peak style reflow profile.<}0{>右边的图像用一较短的斜峰型回流曲线描绘相同的堆叠。<0}

{0>The linear ramp-to-peak reflow profile shows a noteworthy improvement in the voiding percentage of the solder joint.  Of course, each application may require a slightly different reflow profile, depending on several parameters such as solder alloy, surface finish, and thermal mass of your assembly.  For help selecting the best preform and optimal reflow process for your application, contact one of our technical support engineers at askus@indium.com. –Brandon Judd<}0{>线性的斜峰回流曲线显著地改善焊接接头的空隙百分比。当然，每种应用都需要略微不同的回流曲线，取决于各种曲线，如焊接合金,表面油漆以及你们装配的热质量。要为你们的应用选择最佳的预制片和最优秀的回流曲线，请联系我们的一位技术支持工程师askus@indium.com–Brandon Judd<0}

{0>Brandon knows reflow profiling.<}0{>Brandon知道回流曲线。<0} {0>Check out his blog here: Link to Brandon Judd’s Blog.<}0{>在这里检查博客: 连接到Brandon Judd的博客。<0}

{0>*This post is part of the World of Solder Preforms series<}100{>*该帖子属于焊接预制片世界系列。<0}

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