在SMTAI 2014上介紹兩種新產品

{0>As with many companies exhibiting at SMTAI, Indium Corporation is featuring several new products that address many of the concerns of our customers.<}0{>Indium正和許多公司在SMTAI上參展，介紹幾種新的產品，解釋我們客戶關心的問題。<0} {0>I recently posted about Indium10.1, a Pb-free solder paste that prevents voiding under large components, and we recently introduced RMA-155, a solder paste and flux designed for balanced performance on high-complexity boards with a variety of component sizes.<}0{>我最近張貼了有關Indium10.1，的帖子，一種無鉛的焊錫膏，可以防止大元件的空隙，我們最介紹了RMA-155， 一種專門為了元件大小各不相同的高複雜性複合板上的平衡性能設計的焊錫膏。<0} {0>But Indium Corporation is more than just solder paste.<}0{>但Indium公司不只生產焊錫膏。<0}

{0>We also have other forms of solder that will enhance your soldering processes:<}0{>我們還生產其他形式的焊錫膏，可以促進你們的焊接工藝:<0}

• {0>SACm™ , a Mn-doped SAC solder that provides reliability comparable to SAC305 but at a reduced cost.<}0{>SACm™，一種浸漬Mn的SAC焊錫膏，與SAC305相比，可性性高但成本降低。<0}
• {0>Solder Fortification® preforms , which are pieces shaped alloy metals that are used to increase solder volume above what could be achieved by just using solder paste.<}0{>Solder Fortification®預製片，是片狀形式的合金材料，無論使用什麼焊錫膏，都可以增加焊接體積。<0}

{0>You can view more information on these products here, or visit Indium Corporation at booth 430 to learn more about our featured products!<}0{>關於這些產品更多的資訊人，可以查看這裏，或者參觀在430號攤位的Indium公司，更多地瞭解我們有特點的產品!<0}

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