在SMTAI 2014上介绍两种新产品

{0>As with many companies exhibiting at SMTAI, Indium Corporation is featuring several new products that address many of the concerns of our customers.<}0{>Indium正和许多公司在SMTAI上参展，介绍几种新的产品，解释我们客户关心的问题。<0} {0>I recently posted about Indium10.1, a Pb-free solder paste that prevents voiding under large components, and we recently introduced RMA-155, a solder paste and flux designed for balanced performance on high-complexity boards with a variety of component sizes.<}0{>我最近张贴了有关Indium10.1，的帖子，一种无铅的焊锡膏，可以防止大元件的空隙，我们最介绍了RMA-155， 一种专门为了元件大小各不相同的高复杂性复合板上的平衡性能设计的焊锡膏。<0} {0>But Indium Corporation is more than just solder paste.<}0{>但Indium公司不只生产焊锡膏。<0}

{0>We also have other forms of solder that will enhance your soldering processes:<}0{>我们还生产其它形式的焊锡膏，可以促进你们的焊接工艺:<0}

• {0>SACm™ , a Mn-doped SAC solder that provides reliability comparable to SAC305 but at a reduced cost.<}0{>SACm™，一种浸渍Mn的SAC焊锡膏，与SAC305相比，可性性高但成本降低。<0}
• {0>Solder Fortification® preforms , which are pieces shaped alloy metals that are used to increase solder volume above what could be achieved by just using solder paste.<}0{>Solder Fortification®预制片，是片状形式的合金材料，无论使用什么焊锡膏，都可以增加焊接体积。<0}

{0>You can view more information on these products here, or visit Indium Corporation at booth 430 to learn more about our featured products!<}0{>关于这些产品更多的信息人，可以查看这里，或者参观在430号摊位的Indium公司，更多地了解我们有特点的产品!<0}

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