优化零应力点

{0>An important quote from Eliminating Bond Stresses of Sputtering Targets at Operating Temperatures is: “This suggests that a target bonded at one-half of the temperature difference between room temperature and operational temperature would have the most overall desirable characteristics, since it is impossible to rule out thermal expansion mismatches in most materials.”<}0{>在操作温度下消除溅射靶材的粘合应力 的一段重要引言是: “这意味着在室温和操作温度之间温度差异的一半下粘合的靶材具有最有价值的特点，因为在大多数的材料上都不可能排除热膨胀的误配。”<0}

{0>Yes, we have to accept the fact that heating assemblies (like bonded sputtering targets) forces the materials to expand.<}0{>是的，我们必须接受加热装配(如粘合的溅射靶材)致使材料膨胀。<0} {0>Let’s take a look at how we can minimize the stresses in the bond, which correlate to the differential strain in the materials.<}0{>让我们看一下我们如何在粘合中减少应力, 这涉及材料中的材料张力。<0}

{0>ε=αΔT<}0{>ε=αΔT<0}

{0>Where:<}100{>其中:<0}

{0>          ε is strain<}0{>          ε是张力<0}

{0>α is the coefficient of expansion<}0{>α为膨胀系数<0}

{0>ΔT is the change in temperature<}0{>ΔT是温度的变化<0}

{0>And:<}89{>而且： <0}

{0>When ε1 does not equal ε2 and the materials are bound together, shear forces will create stresses in the bond area.<}0{>当 ε1 不等于 ε2 ，材料被粘合在一起时, 剪切力会在粘合区产生应力。<0}

{0>As you can clearly see, there are not too many variables for us to manipulate.<}0{>你们可以明确地看到, 我们操作的变量不多。<0} {0>Keeping strain ε1 and ε2 as similar as possible is key.<}0{>保持张力 ε1和 ε2 尽可能熟悉是关键。<0} {0>We can either match the coefficient as closely as possible or we can make sure the ΔT stays low.<}0{>我们可以尽可能密切地配合系统或者确保 ΔT保持低数值。<0} {0>The first step you should take is to try to match the CTE (α) of your backing plate and target material.<}0{>你们采取的第一步是尽量配合垫板和目标材料的CTE (α)。<0} {0>When this isn’t possible, it’s time to think of ways to keep ΔT as low as possible.<}0{>如果无法做到, 应该考虑保持 ΔT尽可能低的方法。<0}

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