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Project 99:对抗SMT波峰焊中的锡尖怪

Tuesday, February 7, 2017

 

在表面贴装技术(SMT)的波峰焊中,锡尖像钟乳石一样挂在电路板底部。可能的原因包括:

  • 焊料温度过低
  • 焊料的波峰过高或者不均匀
  • 焊料被污染
  • 错误地设置了预热温度(过高或过低)
  • 助焊剂被污染或其比重过低
  • 助焊剂涂敷器的设置错误
  • 传送带速度过快或角度过小
  • 电路板或元件的可焊性较差
  • 元件引线过长
  • 过多的焊料沉积
  • 助焊剂活性不足

锡尖是常见的外观缺陷和真正的“ 坏蛋”,不仅“貌不出众”,也是工艺欠佳的体现。此外如果锡尖与其他导电表面接触,还会对电气完整性构成威胁。

影子武士(Shadow Warrior,或WF-9958)将隐蔽性和强度完美结合,能够打败锡尖怪(Icicles)等众多“坏蛋”们。他还能预防焊接后的电迁移和腐蚀,满足IPC J-STD-004(B)中对表面绝缘电阻(SIR)和电化学迁移要求。影子武士(Shadow Warrior)能轻松融入电路板环境,并允许电子测试探针穿过他而不影响其效果。

影子武士(Shadow Warrior)集 不逊于PCB-40的强度和炼金术士(Alchemist)的隐蔽性与可探测性优势于一身。与炼金术士(Alchemist)一样,影子武士(Shadow Warrior)也不包含松香或卤素。

如欲了解有关 Project 99 波峰焊助焊剂或测试流程的详情,敬请发送电子邮件至eslezak@indium.com,或访问www.indium.com/project99。

要阅读更多吗? 访问记录的内容表,或回到博克的主页。

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